Supermicro and Solidigm: Revolutionizing Storage for AI Workloads
NVIDIA’s GTC is always a hotspot for innovation. This year, two industry leaders, Supermicro and Solidigm, brought their cutting-edge solutions designed for the next wave of AI workloads for CSP and Hyperscalers. From high-density storage to powerful cooling solutions, their collaboration is shaping the future of data centers. Wendell Wenjen, director of storage market development at Supermicro, and Shirish Bhargava, of Solidigm’s global field sales, sat down with TechArena to discuss how their partnership is addressing the growing demands of AI and what lies ahead for next-generation data center infrastructure.
Supermicro, known for pushing the envelope in server technology, showcased their latest systems directed at powering AI applications. Central to their presentation was the NVIDIA HGX B300 NVL16, featuring the powerful NVIDIA Blackwell UltraGPUs— Supermicro’s most advanced GPU solutions to date. These high-performance servers were designed with AI in mind, supporting the growing demand for deep learning and large-scale data processing. Supermicro also introduced a range of storage solutions optimized for AI workloads.
Another exciting announcement was the launch of a new 1U Petascale storage system, equipped with the NVIDIA Grace CPU. This dual-die, high-performance processor delivers impressive power efficiency, ideal for the ever-growing demands of AI. For those seeking even more storage efficiency, Supermicro unveiled a JBOF system powered by NVIDIA’s BlueField-3 DPU, which supports demanding storage workloads with lower power usage.
However, it wasn’t just Supermicro’s hardware that drew attention at GTC. Solidigm, a leader in enterprise solid-state drive (SSD) solutions, brought its own innovative technology to the table. The Solidigm D5 P5336 SSD, a 122 TB powerhouse, was also on display, offering extreme storage density that is essential for AI training and large-scale data management in all form factors. This SSD is part of Solidigm’s broader portfolio designed for AI, providing the kind of performance and capacity needed to handle massive datasets with low latency.
But what makes this collaboration truly stand out is the shared commitment to pushing the boundaries of storage capacity and efficiency. Supermicro and Solidigm’s joint focus on reducing data center footprint while maximizing storage capacity is a game-changer. By using Solidigm’s 122 TB quad-level cell (QLC) SSDs, Supermicro is able to pack three petabytes of storage into a 2U server, a dramatic leap from the previous one-petabyte systems. This compact, high-capacity solution not only optimizes data center space, but also reduces power consumption, making it a win-win for enterprises and service providers alike.
In an industry where cooling and power efficiency are critical, Supermicro’s approach to liquid cooling for high-performance GPUs stood out. Some of today’s most powerful GPUs can consume over 1,000 watts, making liquid cooling a necessity for keeping systems running at optimal temperatures. Supermicro’s comprehensive liquid cooling solution — ranging from cold plates for CPUs and GPUs to large outdoor cooling towers — ensures that even the most demanding AI systems stay cool, efficient and reliable.
So, what’s the TechArena take? This partnership between Supermicro and Solidigm is a testament to the importance of collaboration in driving innovation. Both companies have long been at the forefront of their respective fields, and their combined efforts are delivering practical, high-performance solutions to address the challenges of modern AI workloads.
For those looking to learn more, Supermicro offers an abundance of resources on their website (supermicro.com) and social media channels (X, LinkedIn and YouTube).
NVIDIA’s GTC is always a hotspot for innovation. This year, two industry leaders, Supermicro and Solidigm, brought their cutting-edge solutions designed for the next wave of AI workloads for CSP and Hyperscalers. From high-density storage to powerful cooling solutions, their collaboration is shaping the future of data centers. Wendell Wenjen, director of storage market development at Supermicro, and Shirish Bhargava, of Solidigm’s global field sales, sat down with TechArena to discuss how their partnership is addressing the growing demands of AI and what lies ahead for next-generation data center infrastructure.
Supermicro, known for pushing the envelope in server technology, showcased their latest systems directed at powering AI applications. Central to their presentation was the NVIDIA HGX B300 NVL16, featuring the powerful NVIDIA Blackwell UltraGPUs— Supermicro’s most advanced GPU solutions to date. These high-performance servers were designed with AI in mind, supporting the growing demand for deep learning and large-scale data processing. Supermicro also introduced a range of storage solutions optimized for AI workloads.
Another exciting announcement was the launch of a new 1U Petascale storage system, equipped with the NVIDIA Grace CPU. This dual-die, high-performance processor delivers impressive power efficiency, ideal for the ever-growing demands of AI. For those seeking even more storage efficiency, Supermicro unveiled a JBOF system powered by NVIDIA’s BlueField-3 DPU, which supports demanding storage workloads with lower power usage.
However, it wasn’t just Supermicro’s hardware that drew attention at GTC. Solidigm, a leader in enterprise solid-state drive (SSD) solutions, brought its own innovative technology to the table. The Solidigm D5 P5336 SSD, a 122 TB powerhouse, was also on display, offering extreme storage density that is essential for AI training and large-scale data management in all form factors. This SSD is part of Solidigm’s broader portfolio designed for AI, providing the kind of performance and capacity needed to handle massive datasets with low latency.
But what makes this collaboration truly stand out is the shared commitment to pushing the boundaries of storage capacity and efficiency. Supermicro and Solidigm’s joint focus on reducing data center footprint while maximizing storage capacity is a game-changer. By using Solidigm’s 122 TB quad-level cell (QLC) SSDs, Supermicro is able to pack three petabytes of storage into a 2U server, a dramatic leap from the previous one-petabyte systems. This compact, high-capacity solution not only optimizes data center space, but also reduces power consumption, making it a win-win for enterprises and service providers alike.
In an industry where cooling and power efficiency are critical, Supermicro’s approach to liquid cooling for high-performance GPUs stood out. Some of today’s most powerful GPUs can consume over 1,000 watts, making liquid cooling a necessity for keeping systems running at optimal temperatures. Supermicro’s comprehensive liquid cooling solution — ranging from cold plates for CPUs and GPUs to large outdoor cooling towers — ensures that even the most demanding AI systems stay cool, efficient and reliable.
So, what’s the TechArena take? This partnership between Supermicro and Solidigm is a testament to the importance of collaboration in driving innovation. Both companies have long been at the forefront of their respective fields, and their combined efforts are delivering practical, high-performance solutions to address the challenges of modern AI workloads.
For those looking to learn more, Supermicro offers an abundance of resources on their website (supermicro.com) and social media channels (X, LinkedIn and YouTube).
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