Data Center
articles
AI Is Squeezing Storage Supply—and VAST Wants Your Flash
AI demand is tightening HDD and NAND supply—and prices may follow. VAST is betting on flash reclamation and KV-cache persistence as storage starts acting more like memory.
RackRenew Turns Decommissioned OCP Hardware into Ready Capacity
RackRenew remanufactures OCP compliant-infrastructure into certified, warranty-backed assemblies—standardized, tested, and ready to deploy for faster capacity without bespoke engineering.
5 Data Infrastructure Shifts That Will Define Enterprise AI in 2026
These data-infrastructure shifts will determine which enterprises scale AI in 2026, from real-time context and agentic guardrails to governance, efficiency, and a more resilient data foundation.
OCP 2025: Arm’s Chiplet Play Aims To Democratize AI Compute
Arm’s OCP board seat and new FCSA spec push chiplet interoperability from idea to implementation—enabling mix-and-match silicon and smarter storage so teams can build AI without hyperscaler budgets.
Achieving HPC Performance with Xeon 6 Processors
Xeon 6 marries P-cores, E-cores, and scalable memory to feed data-hungry HPC workloads, eliminating bandwidth bottlenecks so spectral sims and other memory-bound codes can finally scale.
AI Is Squeezing Storage Supply—and VAST Wants Your Flash
AI demand is tightening HDD and NAND supply—and prices may follow. VAST is betting on flash reclamation and KV-cache persistence as storage starts acting more like memory.
RackRenew Turns Decommissioned OCP Hardware into Ready Capacity
RackRenew remanufactures OCP compliant-infrastructure into certified, warranty-backed assemblies—standardized, tested, and ready to deploy for faster capacity without bespoke engineering.
5 Data Infrastructure Shifts That Will Define Enterprise AI in 2026
These data-infrastructure shifts will determine which enterprises scale AI in 2026, from real-time context and agentic guardrails to governance, efficiency, and a more resilient data foundation.
OCP 2025: Arm’s Chiplet Play Aims To Democratize AI Compute
Arm’s OCP board seat and new FCSA spec push chiplet interoperability from idea to implementation—enabling mix-and-match silicon and smarter storage so teams can build AI without hyperscaler budgets.
Achieving HPC Performance with Xeon 6 Processors
Xeon 6 marries P-cores, E-cores, and scalable memory to feed data-hungry HPC workloads, eliminating bandwidth bottlenecks so spectral sims and other memory-bound codes can finally scale.
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Podcasts
An Open Computing Landscape with OpenUK’s Amanda Brock
TechArena host Allyson Klein chats with OpenUK CEO Amanda Brock live from the OCP Regional Summit in Prague on her organization’s mission to drive open software, hardware and data contributions for UK developers.
The In-Memory Future of Applications with Oracle
TechArena host Allyson Klein chats with Oracle VP Shasank Chavan about in-memory databases, customer demands in a data centric world, and how infrastructure must change to fuel customer needs.
The Future of Semi Innovation from Disruptive Memory to Chiplets with Alphawave Semi
TechArena host Allyson Klein chats with Alphawave Semi’s Letizia Guiliano about the future of semiconductor innovation across memory, optical and interoperable chiplet solutions and how her company is poised to deliver leadership innovation rooted in standards.
CXL Enabled Memory Innovation with Memverge
TechArena host Allyson Klein chats with Memverge founder and CEO Charles Fan about his company’s disruptive vision for breaking through data center memory limitations and what the CXL standard will bring to infrastructure innovation.
Breakthrough Data Center Platform Innovation with AMD
TechArena host Allyson Klein chats with AMD senior fellow and CXL technical taskforce co-chair Mahesh Wagh regarding AMD’s entry of CXL platforms into the market gen 4 AMD EYPC processors and his organization’s strategy to deliver disruptive innovation utilizing CXL capability in the years ahead.
UCIe Unleashing Chiplet Innovation with NVIDIA
TechArena host Allyson Klein chats with NVIDIA Data Center Product Architect and Universal Chiplet Interconnect Express organization board member Durgesh Srivastava about the new UCIe specification and how it will reshape the foundations of compute architectures.
OCP, Power Grids & Open Racks — with Dr. Andrew Chien
From OCP Summit San Jose, Allyson Klein and co-host Jeniece Wnorowski interview Dr. Andrew Chien (UChicago & Argonne) on grid interconnects, rack-scale standards, and how openness speeds innovation.
Ventiva Reinvents Cooling with Silent Airflow Tech
Ventiva CEO Carl Schlachte joins Allyson Klein to share how the company’s Ionic Cooling Engine is transforming laptops, servers, and beyond with silent, modular airflow.
Cracking the Code on Storage Efficiency with Solidigm
Explore myths, metrics, and strategies shaping the future of energy-efficient data centers with Solidigm’s Scott Shadley, from smarter drives to sustainability-ready architectures.
Immersion Cooling: Revolutionizing AI & Edge Computing
Allyson Klein and Jeniece Wnorowski welcome Mohan Potheri of Hypertec to explore how immersion cooling slashes energy use, shrinks data-center footprints, and powers sustainable, high-density AI, HPC, and edge solutions on this Data Insights episode.
SayTEC Powers Scalable, Secure, Sovereign IT Infrastructure
SayTEC redefines IT with a zero trust, hyper-converged platform delivering sovereign cloud, seamless scalability, and military-grade security for critical industries.
Flexibility at the Edge: Pragmatic Semiconductor’s Bold Approach
In this podcast, Pragmatic Semi CEO David Moore shares how flexible, sustainable ICs are unlocking new edge AI and IoT applications—powered by a low-carbon, high-volume fab model.
