Helios puts “rack as product” in market, Intel’s rack-scale vision shows up on the floor, and vendors from Giga Computing to Rack Renew turn open specs into buyable racks, pods—and faster time-to-online.

Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.

CEO Carl Schlachte joins TechArena at OCP Summit to share how Ventiva’s solid-state cooling—proven in dense laptops—scales to servers, cutting noise, complexity and power while speeding deployment.

From OCP Summit San Jose, Allyson Klein and co-host Jeniece Wnorowski interview Dr. Andrew Chien (UChicago & Argonne) on grid interconnects, rack-scale standards, and how openness speeds innovation.

From OCP Summit, Metrum AI CEO Steen Graham unpacks multi-agent infrastructure, SSD-accelerated RAG, and the memory-to-storage shift—plus a 2026 roadmap to boost GPU utilization, uptime, and time-to-value.

From the OCP Global Summit in San Jose, Allyson Klein sits down with Chris Butler of Flex to unpack how the company is collapsing the gap between IT and power—literally and figuratively.

From OCP Summit 2025, Kelley Mullick joins Allyson Klein and co-host Jeniece Wnorowski for a Data Insights episode on rack-scale design, hybrid cooling (incl. immersion heat recapture), and open standards.

At OCP’s 2025 global summit, Momenthesis founder Matty Bakkeren joins Allyson Klein to explore why open standards and interoperability are vital to sustaining AI innovation at datacenter scale.

Open collaboration just leveled up: OCP pushes shared specs from rack to data center—power, cooling, networking, and ops—so AI capacity can scale faster, with less friction and more choice.

AMI CEO Sanjoy Maity joins In the Arena to unpack the company's shift to open source firmware, OCP contributions, OpenBMC hardening, and the rack-scale future—cooling, power, telemetry, and RAS built for AI.

Appointment to Open Compute Project Foundation board of directors, contribution of Foundation Chiplet System Architecture (FCSA) spec underscore Arm’s ascendency in hyperscale, AI data centers.

Graid Technology takes on Intel VROC licensing for data center and workstation customers, extending its RAID portfolio to offer both CPU-integrated and GPU-accelerated solutions.

CelLink’s ultrathin flex harnessing ushers in a new era in compute infrastructure innovation, cutting cable volume by up to 90% and boosting density, reliability, and efficiency.

From data center to edge, Arm is enabling full-stack AI efficiency, powering ecosystems with performance-per-watt optimization, tailored silicon, and software portability across environments.

Real-Time Energy Routing (RER) treats electricity like data—modular, dynamic, and software-defined—offering a scalable path to resilient, sustainable data center power.

AMD improved energy efficiency 38x—roughly a 97% drop in energy for the same compute—and now targets 20x rack-scale gains by 2030, reimagining AI training, inference, and data-center design.

Exploring how Flex is rethinking data center power and cooling – from 97.5% efficient power shelves to liquid cooling and “grid to chip” solutions – with Chris Butler, President of Embedded & Critical Power.

In this 5 Fast Facts on Compute Efficiency Q&A, CoolIT’s Ben Sutton unpacks how direct liquid cooling (DLC) drives PUE toward ~1.02, unlocks higher rack density, and where it beats immersion on cost and deployment.