AI demand is tightening HDD and NAND supply—and prices may follow. VAST is betting on flash reclamation and KV-cache persistence as storage starts acting more like memory.
RackRenew remanufactures OCP compliant-infrastructure into certified, warranty-backed assemblies—standardized, tested, and ready to deploy for faster capacity without bespoke engineering.
These data-infrastructure shifts will determine which enterprises scale AI in 2026, from real-time context and agentic guardrails to governance, efficiency, and a more resilient data foundation.
Arm’s OCP board seat and new FCSA spec push chiplet interoperability from idea to implementation—enabling mix-and-match silicon and smarter storage so teams can build AI without hyperscaler budgets.
Xeon 6 marries P-cores, E-cores, and scalable memory to feed data-hungry HPC workloads, eliminating bandwidth bottlenecks so spectral sims and other memory-bound codes can finally scale.
New integration delivers enterprise-grade backup, disaster recovery, and cyber resilience for virtualized and container-based workloads across Platform9’s Private Cloud Director.
After a DOJ settlement, HPE’s $14B Juniper acquisition is set to close, paving the way for a new wave of AI-native networking innovation built for cloud, enterprise, and edge.
At Cloud Field Day 23, Qumulo showcased its cloud data fabric, unifying hybrid environments and solving real-world challenges in media, pharma, public safety, and more with strict data consistency.
A solution from HPE and SAP aims to simplify SAP Cloud ERP adoption with managed private cloud, ecosystem integration, and AI agents for enterprise transformation.
As AI drives explosive data growth, next-gen SSDs deliver the speed, density, and efficiency to outpace HDDs—reshaping storage strategy for tomorrow’s data-centric data centers.
Quantum breakthroughs from Microsoft, Quantinuum, and Google signal accelerating progress—but are we nearing a tipping point or still deep in the hype cycle?
TechArena host Allyson Klein chats with Ampere Chief Product Officer Jeff Wittich about his company’s progress in winning data center deployments, advances in performance and sustainability, and pushing the limits on core density.
TechArena host Allyson Klein chats with Fortinet security experts Srija Allam and Julian Petersohn about the expansive Fortinet solution portfolio and how the company is leaning into AI to help deliver the protection customers require.
TechArena host Allyson Klein sits down with the marketing co-chairs of the CXL Consortium at SC’23 to discuss the introduction of the new 3.1 spec, the emergence of true CXL 2.0 solutions, and what comes next from this disruptive standard that will re-define data center infrastructure.
TechArena host Allyson Klein sat down with AMD’s Robert Hormuth and Prabhu Jayanna at the Open Compute Summit to discuss the advancements AMD EPYC processors have delivered in performance, performance efficiency and security capability including AMD’s Infinity Guard technology.
TechArena host Allyson Klein chats with Arm’s Eddie Ramirez at the Open Compute Summit about the architecture’s progress in data center, growing a thriving ecosystem, and the sustainability advantages of Arm’s design making it even more attractive to data center operators.
TechArena host Allyson Klein chats with Solidigm’s Roger Corell and Tahmid Rahman at the OCP Summit about their company’s heritage in the storage arena and how their SSD portfolio delivers the performance and efficiency required for the AI era.
Rose-Hulman Institute of Technology shares how Azure Local, AVD, and GPU-powered infrastructure are transforming IT operations and enabling device-agnostic access to high-performance engineering software.
From #OCPSummit25, this Data Insights episode unpacks how RackRenew remanufactures OCP-compliant racks, servers, networking, power, and storage—turning hyperscaler discards into ready-to-deploy capacity.
Midas Immersion Cooling CEO Scott Sickmiller joins a Data Insights episode at OCP 2025 to demystify single-phase immersion, natural vs. forced convection, and what it takes to do liquid cooling at AI scale.
From hyperscale direct-to-chip to micron-level realities: Darren Burgess (Castrol) explains dielectric fluids, additive packs, particle risks, and how OCP standards keep large deployments on track.
Recorded live at OCP in San Jose, Allyson Klein talks with CESQ’s Lesya Dymyd about hybrid quantum-classical computing, the new Maison du Quantique, and how real-world use cases may emerge over the next 5–7 years.