Data Center
Highlights
It’s No Coincidence that Wait-and-See Rhymes with Latency
Jim Fister dives deep into the intricacies of system memory, latency, and data management, exploring how modern computing architectures handle data retrieval and processing.
Advanced Packaging: Driving the AI Era Forward
AI is driving an acceleration of compute demands fueled by the proliferation of large language models across industry use cases. This requirement comes as traditional semiconductor technology pushes against the laws of physics with the slowing of Moore’s Law.
Contextual AI and WEKA Partner for Enterprise Class AI Activation
This week, Contextual AI partnered with WEKA to deliver enterprise AI services on Google Cloud using RAG 2.0 from Facebook AI Research. WEKA's platform boosted performance, achieving a 3X increase in key AI use cases, 4X faster model checkpointing, and reduced costs.
Data Center Industry Veteran Lynn Comp Shares 3 Patterns Observed Over 30 Years in Tech
Data center industry veteran Lynn Comp shares insights from her career, discussing the importance of adaptability, emotional IQ, and practical tech. She highlights three patterns: customers prefer reliability over high-performance solutions, network limitations can negate compute power, and economic realities can override technological enthusiasm.
Dog Days of Summer – Looking forward to OCP Summit
The upcoming OCP Summit in October will feature nineteen top-tier sponsors, up from just three in previous years, highlighting OCP’s role in AI infrastructure innovation. TechArena is excited to be a media sponsor, covering sustainable infrastructure, Sonic’s future, memory advancements, and power and cooling solutions with daily podcasts, video interviews, and stories.
It’s Gettin’ Hot in Here: Industry veteran Jim Fister unpacks the history of the data center
In this blog post, industry veteran Jim Fister explores the evolution of data centers from early 2000s servers to modern AI/ML racks. Highlighting engineering and logistical challenges, he emphasizes the need for ongoing innovation and celebrates engineers while anticipating future advancements to meet increasing power demands.
Hypertec Shrinks the Data Center with Immersion-Born Servers
Hypertec’s immersion-born servers cut cooling power by 50% and shrink 10MW deployments from 100,000 sq ft to around 10,000—showing liquid cooling isn’t experimental anymore; it’s essential.
Immersion Cooling: Revolutionizing AI & Edge Computing
Allyson Klein and Jeniece Wnorowski welcome Mohan Potheri of Hypertec to explore how immersion cooling slashes energy use, shrinks data-center footprints, and powers sustainable, high-density AI, HPC, and edge solutions on this Data Insights episode.
Mid-Year Report: AI Spending Soars as Data Centers Face Heat
Matty Bakkeren checks in on how data center trends are playing out in 2025, from nations pouring billions into AI supremacy projects to how data centers are trying to offset massive energy needs.
Platform9 and Commvault Partner on Private Cloud Protection
New integration delivers enterprise-grade backup, disaster recovery, and cyber resilience for virtualized and container-based workloads across Platform9’s Private Cloud Director.
TechArena's Allyson Klein: Silicon Valley Kid to Tech Storyteller
From childhood gaming consoles to guiding Intel’s message to market, Allyson Klein has spent decades proving that the best tech stories happen when engineers feel invited to share what they’ve created.
Qumulo Showcases Cloud Data Fabric Innovation
At Cloud Field Day 23, Qumulo showcased its cloud data fabric, unifying hybrid environments and solving real-world challenges in media, pharma, public safety, and more with strict data consistency.
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Podcasts
Revolutionizing RAID: Graid's Supreme Solution for Modern Data Challenges
Allyson Klein and Jeniece Wnorowski chat with Kelley Osburn of Graid about SupremeRAID™ and its role in tackling high-performance storage challenges in data-driven environments.
Data Center in the AI Era with Jen Huffstetler
Join Allyson Klein as she welcomes former colleague/ industry innovator Jen Huffstetler. Jen shares her extensive experience driving advancements from client devices to the data center, including groundbreaking technologies like Centrino and 3D packaging.
Advanced Packaging Innovations in the Semiconductor Industry with Chee Ping Lee of Lam Research
In this podcast, learn about the challenges of silicon advancement, the importance of advanced packaging, and how Lam is driving breakthroughs to support the future of AI and chiplet ecosystems.
Sneak peek: What to expect at the OCP conference with Schneider Electric’s Alex Rakow and Intel’s Eric Dahlen
Join host Allyson Klein in this insightful episode of Tech Arena, featuring Eric Dahlen from Intel and Alex Rakow from Schneider Electric. As co-chairs of the Compute Sustainability group within the Open Compute Project, Eric and Alex discuss their roles, the initiative's goals, and the impact of AI on data center sustainability. They delve into the challenges and innovations in power and cooling technologies, embodied carbon, and circularity practices. Get a sneak peek into what to expect at the upcoming OCP Summit and how industry leaders are pushing the boundaries of sustainable technology.
Sprinting Towards an AI Future with Microsoft’s Nidhi Chappell
TechArena host Allyson Klein chats with Microsoft’s Vice President of Azure AI and HPC Infrastructure, Nidhi Chappell, in advance of Microsoft Build 2024. Nidhi shares how her organization is accelerating deployments of critical technology to fuel the insatiable demand for AI around the world and how Microsoft’s AI tools including co-pilot, Open AI and more have been met with overwhelming engagement from developers. She also talks about Microsoft’s silicon plans and strategic collaborations with NVIDIA and AMD.
Driving Sustainable Data Center Infrastructure for the Next Wave of Greenfield Buildout with Jon Summers
TechArena host Allyson Klein chats with Research Institute of Sweden’s Jon Summers about the latest research his team has conducted on efficient infrastructure and data center buildout in the wake of massive data center growth for the AI era.
The Future of Semi Innovation from Disruptive Memory to Chiplets with Alphawave Semi
TechArena host Allyson Klein chats with Alphawave Semi’s Letizia Guiliano about the future of semiconductor innovation across memory, optical and interoperable chiplet solutions and how her company is poised to deliver leadership innovation rooted in standards.
CXL Enabled Memory Innovation with Memverge
TechArena host Allyson Klein chats with Memverge founder and CEO Charles Fan about his company’s disruptive vision for breaking through data center memory limitations and what the CXL standard will bring to infrastructure innovation.
Breakthrough Data Center Platform Innovation with AMD
TechArena host Allyson Klein chats with AMD senior fellow and CXL technical taskforce co-chair Mahesh Wagh regarding AMD’s entry of CXL platforms into the market gen 4 AMD EYPC processors and his organization’s strategy to deliver disruptive innovation utilizing CXL capability in the years ahead.
UCIe Unleashing Chiplet Innovation with NVIDIA
TechArena host Allyson Klein chats with NVIDIA Data Center Product Architect and Universal Chiplet Interconnect Express organization board member Durgesh Srivastava about the new UCIe specification and how it will reshape the foundations of compute architectures.
Bespoke Cloud Services with Bev Crair
TechArena host talks with Bev Crair, Senior Vice President of Oracle Cloud Infrastructure Compute about her team’s delivery of bespoke services and efforts to simplify multi-cloud adoption.
The Battle for Multi-Cloud Security
TechArena host Allyson Klein chats with Checkpoint Software's TJ Gonen about the state of cloud security and how security solutions must start with a developer lens
