Data Center
Highlights
Qumulo Showcases Cloud Data Fabric Innovation
At Cloud Field Day 23, Qumulo showcased its cloud data fabric, unifying hybrid environments and solving real-world challenges in media, pharma, public safety, and more with strict data consistency.
HPE Greenlake Paves a Path to a Hybrid SAP ERP Future
A solution from HPE and SAP aims to simplify SAP Cloud ERP adoption with managed private cloud, ecosystem integration, and AI agents for enterprise transformation.
Scality Showcases Real-World Resilient Cloud Storage Solutions
At Cloud Field Day 23, Scality highlighted real-world deployments that tackle petabyte-scale challenges with resilience, flexibility, and customer-driven innovation.
TechArena Report: 2025 Storage Demands Call for a Change
As AI drives explosive data growth, next-gen SSDs deliver the speed, density, and efficiency to outpace HDDs—reshaping storage strategy for tomorrow’s data-centric data centers.
What’s next in CVEs Shaping Cybersecurity Compliance in 2025?
The Common Vulnerabilities and Exposures (CVE) landscape is shifting—governance is changing, and security pros are moving beyond raw CVE counts to focus on context-aware, risk-based vulnerability management.
Quantum Momentum: Nearing a Tipping Point or Just Growing Hype?
Quantum breakthroughs from Microsoft, Quantinuum, and Google signal accelerating progress—but are we nearing a tipping point or still deep in the hype cycle?
Iceotope Delivers Great Chemistry for Cool Data Centers
Iceotope's liquid cooling tech is shaking up data centers as AI drives the need for efficient heat management. Dr. Kelley Mullick explains the shift from air to liquid cooling, highlighting Iceotope's sustainable solutions.
It’s No Coincidence that Wait-and-See Rhymes with Latency
Jim Fister dives deep into the intricacies of system memory, latency, and data management, exploring how modern computing architectures handle data retrieval and processing.
Advanced Packaging: Driving the AI Era Forward
AI is driving an acceleration of compute demands fueled by the proliferation of large language models across industry use cases. This requirement comes as traditional semiconductor technology pushes against the laws of physics with the slowing of Moore’s Law.
Contextual AI and WEKA Partner for Enterprise Class AI Activation
This week, Contextual AI partnered with WEKA to deliver enterprise AI services on Google Cloud using RAG 2.0 from Facebook AI Research. WEKA's platform boosted performance, achieving a 3X increase in key AI use cases, 4X faster model checkpointing, and reduced costs.
Data Center Industry Veteran Lynn Comp Shares 3 Patterns Observed Over 30 Years in Tech
Data center industry veteran Lynn Comp shares insights from her career, discussing the importance of adaptability, emotional IQ, and practical tech. She highlights three patterns: customers prefer reliability over high-performance solutions, network limitations can negate compute power, and economic realities can override technological enthusiasm.
Dog Days of Summer – Looking forward to OCP Summit
The upcoming OCP Summit in October will feature nineteen top-tier sponsors, up from just three in previous years, highlighting OCP’s role in AI infrastructure innovation. TechArena is excited to be a media sponsor, covering sustainable infrastructure, Sonic’s future, memory advancements, and power and cooling solutions with daily podcasts, video interviews, and stories.
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Podcasts
Data Center in the AI Era with Jen Huffstetler
Join Allyson Klein as she welcomes former colleague/ industry innovator Jen Huffstetler. Jen shares her extensive experience driving advancements from client devices to the data center, including groundbreaking technologies like Centrino and 3D packaging.
Advanced Packaging Innovations in the Semiconductor Industry with Chee Ping Lee of Lam Research
In this podcast, learn about the challenges of silicon advancement, the importance of advanced packaging, and how Lam is driving breakthroughs to support the future of AI and chiplet ecosystems.
Sneak peek: What to expect at the OCP conference with Schneider Electric’s Alex Rakow and Intel’s Eric Dahlen
Join host Allyson Klein in this insightful episode of Tech Arena, featuring Eric Dahlen from Intel and Alex Rakow from Schneider Electric. As co-chairs of the Compute Sustainability group within the Open Compute Project, Eric and Alex discuss their roles, the initiative's goals, and the impact of AI on data center sustainability. They delve into the challenges and innovations in power and cooling technologies, embodied carbon, and circularity practices. Get a sneak peek into what to expect at the upcoming OCP Summit and how industry leaders are pushing the boundaries of sustainable technology.
Sprinting Towards an AI Future with Microsoft’s Nidhi Chappell
TechArena host Allyson Klein chats with Microsoft’s Vice President of Azure AI and HPC Infrastructure, Nidhi Chappell, in advance of Microsoft Build 2024. Nidhi shares how her organization is accelerating deployments of critical technology to fuel the insatiable demand for AI around the world and how Microsoft’s AI tools including co-pilot, Open AI and more have been met with overwhelming engagement from developers. She also talks about Microsoft’s silicon plans and strategic collaborations with NVIDIA and AMD.
Driving Sustainable Data Center Infrastructure for the Next Wave of Greenfield Buildout with Jon Summers
TechArena host Allyson Klein chats with Research Institute of Sweden’s Jon Summers about the latest research his team has conducted on efficient infrastructure and data center buildout in the wake of massive data center growth for the AI era.
Disruptive Chiplet Innovation Delivers the Next Wave of Data Center Performance with Palo Alto Electron’s Jawad Nasrullah
TechArena host Allyson Klein chats with Palo Alto Electron CEO Jawad Nasrullah about his vision for an open chiplet economy, the semiconductor manufacturing hurdles standing in the way of broad chiplet market delivery, and how he plans to play a role in shaping this next evolution of the semiconductor landscape.
Exploring Data in the AI Era with Solidigm - New Data Insights Series
The TechArena kicks off a Data Insights Series in collaboration with Solidigm, and TechArena host welcomes co-host Jeniece Wronowski and Solidigm data center marketing director Ace Stryker to the program to talk about data in the AI era, the series objectives, and how SSD innovation sits at the foundation of a new data pipeline.
Charting Architectural Innovation in the Chiplet Era with OCP's Cliff Grossner
TechArena host Allyson Klein chats with OCP’s Cliff Grossner regarding the chiplet era, how architectural evolution has evolved to a chiplet economy, and how the OCP is helping create an open marketplace for innovation.
Building Composable Data Systems with Voltron Data CEO Josh Patterson
TechArena host Allyson Klein chats with Voltron Data CEO Josh Patterson about delivery of Theseus, a composable data system framework that unleashes develops with new interoperability and flexibility for AI era data challenges.
Ampere Advances in the Data Center with Jeff Wittich
TechArena host Allyson Klein chats with Ampere Chief Product Officer Jeff Wittich about his company’s progress in winning data center deployments, advances in performance and sustainability, and pushing the limits on core density.
Security in the AI Era with Fortinet’s Srija Allam and Julian Petersohn
TechArena host Allyson Klein chats with Fortinet security experts Srija Allam and Julian Petersohn about the expansive Fortinet solution portfolio and how the company is leaning into AI to help deliver the protection customers require.
Delivery of the CXL Vision with the CXL Consortium's Kurtis Bowman and Kurt Lender
TechArena host Allyson Klein sits down with the marketing co-chairs of the CXL Consortium at SC’23 to discuss the introduction of the new 3.1 spec, the emergence of true CXL 2.0 solutions, and what comes next from this disruptive standard that will re-define data center infrastructure.
