At Cloud Field Day 23, Qumulo showcased its cloud data fabric, unifying hybrid environments and solving real-world challenges in media, pharma, public safety, and more with strict data consistency.
A solution from HPE and SAP aims to simplify SAP Cloud ERP adoption with managed private cloud, ecosystem integration, and AI agents for enterprise transformation.
At Cloud Field Day 23, Scality highlighted real-world deployments that tackle petabyte-scale challenges with resilience, flexibility, and customer-driven innovation.
As AI drives explosive data growth, next-gen SSDs deliver the speed, density, and efficiency to outpace HDDs—reshaping storage strategy for tomorrow’s data-centric data centers.
The Common Vulnerabilities and Exposures (CVE) landscape is shifting—governance is changing, and security pros are moving beyond raw CVE counts to focus on context-aware, risk-based vulnerability management.
Quantum breakthroughs from Microsoft, Quantinuum, and Google signal accelerating progress—but are we nearing a tipping point or still deep in the hype cycle?
OVHcloud’s infrastructure strategy includes value chain integration, water-cooled data centers and servers with high-performance storage capabilities, setting it apart in the cloud industry.
From breakthrough 122TB SSDs to the industry’s first liquid-cooled storage, Solidigm’s Avi Shetty unpacks how storage is powering AI workloads from hyperscale to neo-cloud.
From GPU and storage servers to turnkey rack-scale solutions, Giga Computing showcases its expanding OCP portfolio and the evolution of Giga PODs for high-density, high-efficiency data centers.
Open Compute EMEA Summit featured announcements of major rack and power architecture innovations that address AI-driven data center challenges with advanced cooling and engineering solutions.
With EDA flows, broad IP, & EMIB-T support ready for Intel 18A/18A-P, Synopsys helps designers tackle high performance chip design.
Ahead of OCP Dublin, Matty Bakkeren joins Allyson Klein to break down rack innovations, liquid cooling, sovereignty, and the trends shaping data center infrastructure across Europe.
Join Allyson Klein as she welcomes former colleague/ industry innovator Jen Huffstetler. Jen shares her extensive experience driving advancements from client devices to the data center, including groundbreaking technologies like Centrino and 3D packaging.
In this podcast, learn about the challenges of silicon advancement, the importance of advanced packaging, and how Lam is driving breakthroughs to support the future of AI and chiplet ecosystems.
Join host Allyson Klein in this insightful episode of Tech Arena, featuring Eric Dahlen from Intel and Alex Rakow from Schneider Electric. As co-chairs of the Compute Sustainability group within the Open Compute Project, Eric and Alex discuss their roles, the initiative's goals, and the impact of AI on data center sustainability. They delve into the challenges and innovations in power and cooling technologies, embodied carbon, and circularity practices. Get a sneak peek into what to expect at the upcoming OCP Summit and how industry leaders are pushing the boundaries of sustainable technology.
TechArena host Allyson Klein chats with Microsoft’s Vice President of Azure AI and HPC Infrastructure, Nidhi Chappell, in advance of Microsoft Build 2024. Nidhi shares how her organization is accelerating deployments of critical technology to fuel the insatiable demand for AI around the world and how Microsoft’s AI tools including co-pilot, Open AI and more have been met with overwhelming engagement from developers. She also talks about Microsoft’s silicon plans and strategic collaborations with NVIDIA and AMD.
TechArena host Allyson Klein chats with Research Institute of Sweden’s Jon Summers about the latest research his team has conducted on efficient infrastructure and data center buildout in the wake of massive data center growth for the AI era.
TechArena host Allyson Klein chats with Palo Alto Electron CEO Jawad Nasrullah about his vision for an open chiplet economy, the semiconductor manufacturing hurdles standing in the way of broad chiplet market delivery, and how he plans to play a role in shaping this next evolution of the semiconductor landscape.
TechArena host Allyson Klein chats with Credo VP Don Barnetson about how his company is delivering innovative optical solutions that address the AI era’s requirements for scalable data movement in the data center and beyond from OCP Lisbon 2024.
TechArena host Allyson Klein chats with Open Compute Project VP of Emerging Markets, Steve Helvie, about the proceedings in Lisbon this week and how OCP is helping to shape the cutting edge of infrastructure innovation.
TechArena host Allyson Klein chats with ZeroPoint Technologies’ VP of Business Development Nilesh Shah about the AI era demands for memory innovation, how advanced chiplet architectures will assist semiconductor teams in advancing memory access for balanced system delivery, and how ZeroPoint Technologies plans to play a strategic role in this major market transition.
TechArena host Allyson Klein chats with HPE’s Jean-Marie Verdun about his organization’s groundbreaking work to redefine firmware management using OpenBMC technology and how this breakthrough addresses data center customer demands.
TechArena host Allyson Klein chats with CircleB’s Matty Bakkeren about how his organization is leveraging OCP specifications to deliver innovative and sustainable solutions to data center customers, how AI is re-shaping operator requirements, and how he sees the market shaping in 2024.
TechArena hosts Allyson Klein and Jeniece Wronowski chat with CoreWeave’s Jacob Yundt about how his organization is delivering a scalable data pipeline to AI customers utilizing breakthrough VAST Data solutions featuring Solidigm QLC SSDs.