Data Center
Highlights
Innovation with Empathy: A Q&A with Vivek Venkatesan
Vanguard lead data engineer and IEEE senior member Vivek Venkatesan shares how a pivotal Botswana project shaped his path, how trust turns innovation into impact , and much more.
CoolIT: 5 Fast Facts on Compute Efficiency
In this 5 Fast Facts on Compute Efficiency Q&A, CoolIT’s Ben Sutton unpacks how direct liquid cooling (DLC) drives PUE toward ~1.02, unlocks higher rack density, and where it beats immersion on cost and deployment.
Mark Grodzinsky on Building Ecosystems That Last
From Wi-Fi to AI, Mark Grodzinsky shares how chance turns, mentors, and market inflection points shaped his career – and why true innovation is about impact, not hype.
Compass & Schneider Launch Prefab Pod for AI Data Centers
The new EcoStruxure™ Pod accelerates data center readiness, reducing complexity, cost, and risk while boosting sustainability and AI workload support.
Microsoft’s Tannu Jiwnani on Responsible Innovation & Cybersecurity
From anti–money-laundering analytics to leading identity protection, Tannu Jiwnani shares how curiosity, resilience, and inclusive leadership shape responsible innovation and why diversity is security’s superpower.
Announcing TechArena’s 2025–2026 Voices of Innovation Fellows
Experts from across the compute industry provide their bold views and real-world expertise on AI era computing is driving business and societal opportunity.
How Ocient is Revolutionizing Data Warehousing for AI
Discover how Ocient’s innovative architecture boosts data efficiency, reduces costs, and supports AI-intensive workloads while prioritizing sustainability in the data warehousing industry.
Flex Demonstrates Leadership with Acquisition of JetCool
Flex strengthens its direct liquid cooling portfolio with its acquisition of JetCool, adding their MIT-developed tech to Flex’s broad offerings across power, cooling and data center infrastructure.
JetCool Tackles AI’s Power Demands with Precision Cooling
JetCool's innovative liquid cooling targets hotspots directly, supporting AI's growing power needs while enhancing sustainability through efficient heat reuse and scalable solutions for data centers.
CoolIT: Leading the Pack on Liquid Cooling
CoolIT Systems is driving efficiency and performance for AI in data centers with cutting-edge liquid cooling solutions.
Arm's Data Center Advances: Chiplets, Efficiency & AI Integration
Arm advances data center tech with power-efficient CPUs, modular chiplet designs, and the scalable Neoverse platform, supporting hyperscalers and AI workloads with sustainable, adaptive solutions.
Boo! TechArena's Spookiest Tech Trends Heading to 2025
This Halloween, TechArena explores 2025’s top spooky tech trends: zombie data haunting storage, AI hallucinations leading to false data, and cyborg advances redefining humanity!
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Podcasts
Sprinting Towards an AI Future with Microsoft’s Nidhi Chappell
TechArena host Allyson Klein chats with Microsoft’s Vice President of Azure AI and HPC Infrastructure, Nidhi Chappell, in advance of Microsoft Build 2024. Nidhi shares how her organization is accelerating deployments of critical technology to fuel the insatiable demand for AI around the world and how Microsoft’s AI tools including co-pilot, Open AI and more have been met with overwhelming engagement from developers. She also talks about Microsoft’s silicon plans and strategic collaborations with NVIDIA and AMD.
Driving Sustainable Data Center Infrastructure for the Next Wave of Greenfield Buildout with Jon Summers
TechArena host Allyson Klein chats with Research Institute of Sweden’s Jon Summers about the latest research his team has conducted on efficient infrastructure and data center buildout in the wake of massive data center growth for the AI era.
Disruptive Chiplet Innovation Delivers the Next Wave of Data Center Performance with Palo Alto Electron’s Jawad Nasrullah
TechArena host Allyson Klein chats with Palo Alto Electron CEO Jawad Nasrullah about his vision for an open chiplet economy, the semiconductor manufacturing hurdles standing in the way of broad chiplet market delivery, and how he plans to play a role in shaping this next evolution of the semiconductor landscape.
Accelerating European Data Center Buildout with OCP’s Raul Alvarez
TechArena host Allyson Klein chats with OCP’s Raul Alvarez on his new charter accelerating growth of the data center market in Europe as well as his ongoing work in immersion cooling technologies from OCP Lisbon 2024.
Delivering a Sustainable Data Platform for the AI Era with Weka, Data Insights Series Sponsored by Solidigm
TechArena host Allyson Klein and Solidigm’s Jeniece Wnorowski chat with Weka’s Joel Kaufman, as he tours the Weka data platform and how the company’s innovation provides sustainable data management that scales for the AI era.
SONIC Network Innovation for the AI Era with PLVision’s Taras Chornyi
TechArena host Allyson Klein chats with PLVision Director of Open Networking Solutions and Strategy, Taras Chornyi, about the progress of SONIC and open network infrastructure for the AI Era.
Inside Confidential Computing with Hushmesh & Invary
Allyson Klein hosts Manu Fontaine (Hushmesh) and Jason Rogers (Invary) to unpack TEEs, attestation, and how confidential computing is moving from pilots to real deployments across data center and edge.
Immersion Cooling: Revolutionizing AI & Edge Computing
Allyson Klein and Jeniece Wnorowski welcome Mohan Potheri of Hypertec to explore how immersion cooling slashes energy use, shrinks data-center footprints, and powers sustainable, high-density AI, HPC, and edge solutions on this Data Insights episode.
SayTEC Powers Scalable, Secure, Sovereign IT Infrastructure
SayTEC redefines IT with a zero trust, hyper-converged platform delivering sovereign cloud, seamless scalability, and military-grade security for critical industries.
Flexibility at the Edge: Pragmatic Semiconductor’s Bold Approach
In this podcast, Pragmatic Semi CEO David Moore shares how flexible, sustainable ICs are unlocking new edge AI and IoT applications—powered by a low-carbon, high-volume fab model.
Protecting Against Quantum Cybersecurity Threats with Winbond
In this In the Arena episode, Winbond’s Jun Kawaguchi discusses their industry-leading strategies for tackling next-gen cybersecurity threats, ensuring robust protection for the future.
PCI-SIG’s Al Yanes on PCIe 7.0, HPC, and the Future of Interconnects
In this podcast, PCI-SIG President Al Yanes explores PCI-SIG's journey to PCIe 7.0, advancements in copper and optical specs, and their pivotal role in HPC and AI.
