Data Center
Highlights
Solidigm Spotlights AI Storage and Liquid Cooling at OCP
From breakthrough 122TB SSDs to the industry’s first liquid-cooled storage, Solidigm’s Avi Shetty unpacks how storage is powering AI workloads from hyperscale to neo-cloud.
Giga Computing Scales OCP Innovation with Giga PODs
From GPU and storage servers to turnkey rack-scale solutions, Giga Computing showcases its expanding OCP portfolio and the evolution of Giga PODs for high-density, high-efficiency data centers.
OCP EMEA Summit Highlights: The Race to 1MW IT Loads per Rack
Open Compute EMEA Summit featured announcements of major rack and power architecture innovations that address AI-driven data center challenges with advanced cooling and engineering solutions.
Synopsys, Intel Foundry Team Up to Spur Angstrom-Scale Innovation
With EDA flows, broad IP, & EMIB-T support ready for Intel 18A/18A-P, Synopsys helps designers tackle high performance chip design.
Inside OCP Innovation: A Fireside Chat with Matty Bakkeren
Ahead of OCP Dublin, Matty Bakkeren joins Allyson Klein to break down rack innovations, liquid cooling, sovereignty, and the trends shaping data center infrastructure across Europe.
Taurus Group Champions Open Infrastructure for Today’s IT Needs
At CloudFest 2025, Taurus Group and Solidigm showcased innovative, flexible IT infrastructure solutions, emphasizing the importance of open platforms and scalable storage for modern businesses.
The Future of VMware: Going Down the Rabbit Hole at VMware Explore 2023
Allyson Klein goes down the rabbit hole of Broadcom’s pending acquisition of VMWare and posits that NSX may be the jewel of the VMWare portfolio.
The Future of Silicon Innovation in the Chiplet Era
TechArena’s take on Alphawave Semi and how Letizia Guiliano and her team are poised to win in the chiplet era
MemCon and the Path Forward with Memory in a Post Moore’s Law World
TechArena’s take on the path to memory innovation from MemCon
Intel Showcases IT Strengths with Sapphire Rapids Delivery
TechArena’s take on Intel’s 4th Generation Xeon Processor launch (aka the arrival of Sapphire Rapids).
The TechArena Cloud 2023
TechArena Cloud 2023 delivers seven strategies for maximizing organizational return based on industry expert perspectives.
The super-sized future is here with AMD’s Instinct MI300
TechArena’s take on AMD’s recent reveal of their Instinct MI300 expected in market later this year and the inflection point towards super-sized chiplet designs.
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Podcasts
Connectivity Innovation for Scalable Data Movement in the AI Era with Credo’s Don Barnetson
TechArena host Allyson Klein chats with Credo VP Don Barnetson about how his company is delivering innovative optical solutions that address the AI era’s requirements for scalable data movement in the data center and beyond from OCP Lisbon 2024.
The Cutting Edge of Data Center Infrastructure Innovation with OCP’s Steve Helvie
TechArena host Allyson Klein chats with Open Compute Project VP of Emerging Markets, Steve Helvie, about the proceedings in Lisbon this week and how OCP is helping to shape the cutting edge of infrastructure innovation.
Re-imagining Memory through Advanced Chiplet Innovation with ZeroPoint Technologies’ Nilesh Shah
TechArena host Allyson Klein chats with ZeroPoint Technologies’ VP of Business Development Nilesh Shah about the AI era demands for memory innovation, how advanced chiplet architectures will assist semiconductor teams in advancing memory access for balanced system delivery, and how ZeroPoint Technologies plans to play a strategic role in this major market transition.
Innovating OpenBMC Enabled Shared Firmware Across the Network with HPE’s Jean-Marie Verdun
TechArena host Allyson Klein chats with HPE’s Jean-Marie Verdun about his organization’s groundbreaking work to redefine firmware management using OpenBMC technology and how this breakthrough addresses data center customer demands.
Advancing Sustainable Infrastructure to Fuel Hungry Workloads with CircleB's Matty Bakkeren
TechArena host Allyson Klein chats with CircleB’s Matty Bakkeren about how his organization is leveraging OCP specifications to deliver innovative and sustainable solutions to data center customers, how AI is re-shaping operator requirements, and how he sees the market shaping in 2024.
Data Insights Series Sponsored by Solidigm: Achieving AI Scale with CoreWeave
TechArena hosts Allyson Klein and Jeniece Wronowski chat with CoreWeave’s Jacob Yundt about how his organization is delivering a scalable data pipeline to AI customers utilizing breakthrough VAST Data solutions featuring Solidigm QLC SSDs.
Flexibility at the Edge: Pragmatic Semiconductor’s Bold Approach
In this podcast, Pragmatic Semi CEO David Moore shares how flexible, sustainable ICs are unlocking new edge AI and IoT applications—powered by a low-carbon, high-volume fab model.
Protecting Against Quantum Cybersecurity Threats with Winbond
In this In the Arena episode, Winbond’s Jun Kawaguchi discusses their industry-leading strategies for tackling next-gen cybersecurity threats, ensuring robust protection for the future.
PCI-SIG’s Al Yanes on PCIe 7.0, HPC, and the Future of Interconnects
In this podcast, PCI-SIG President Al Yanes explores PCI-SIG's journey to PCIe 7.0, advancements in copper and optical specs, and their pivotal role in HPC and AI.
Bill Gropp on the NCSA and the Future of Supercomputing Innovation
In this podcast, NCSA Director Bill Gropp explores the latest advanced computing trends, from AI innovations to groundbreaking research on supercomputing climate models, and how this tech is transforming science and society.
Revolutionizing AI Workloads with Advanced Data Center Solutions
Discover how AI is transforming data centers, with innovations in high-speed networking, emulation, and hyperscale infrastructure driving efficiency and performance in the era of AI workloads.
OCP Summit Recap: Innovation, Collaboration & Future Focus
OCP’s Rob Coyle shares insights on AI, cooling innovations, and open hardware’s role in transforming data centers as the industry accelerates toward scalable, sustainable infrastructure.
